Mobile SoC specialist MediaTek has announced over NT$1 billion (US$35 million) worth of fab tools that the fabless chipmaker will spend for its chip production.
TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
Dialog Semiconductor and Globalfoundries have entered into an agreement in which Dialog licenses its conductive bridging RAM (CBRAM) technology to Globalfoundries, according to the...
IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that the latest system-on-chip (SoC) from artificial intelligence (AI)...
After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a US$40 billion agreement to buy Arm from financially...
Backend houses have seen smooth progress in packaging customized SoCs for Sony's PS5 and yield rates at the foundry partner are also steady, with shipment goal set by the vendor for...
Claims about TSMC having yield rates issues with its 7nm process manufacturing AMD chips for Sony's PlayStation 5 (PS5) games console are highly questionable, according to sources...
Total microprocessor sales are forecast to grow 1.4% in 2020 to nearly US$79.3 billion, following a 2.4% decline in 2019, which was the first revenue drop in the worldwide MPU market...
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
MediaTek has announced its T750 5G chipset designed to power next-generation 5G CPE wireless products, such as fixed wireless access routers (FWA) and mobile hotspots.
MediaTek and Qualcomm have introduced their new AI-capable mobile SoC chips designed specifically for gaming smartphones - the Helio G95 and Snapdragon 732G respectively.
Backend houses continue to enjoy strong chip probing demand for display driver ICs for use in gaming, educational and other-purpose notebooks, thanks to the rise of the stay-at-home...
Renesas Electronics has introduced an ultra-high-definition (UHD) surveillance camera reference design developed in collaboration with Novatek Microelectronics and designed by Systemtec...
MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...
