Ardentec has expressed caution about its sales performance during the fourth quarter of 2012, citing rising inventory levels among customers. Fellow wafer testing company STATS ChipPAC...
STATS ChipPAC has reached a property damage insurance settlement of US$26.7 million with its insurers as compensation for its plant and equipment damaged by flooding in Thailand.
STATS ChipPAC, a semiconductor test and packaging service provider, now expects its third-quarter sales to decrease 3-5% on quarter. The firm previously estimated flat sequential...
STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...
Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...
STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits for the second quarter of its fiscal 2012 declined over 50% from...
STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...
Sales at major IC backend service companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Adventec, all continued to trend...
IC testing house STATS ChipPAC Taiwan Semiconductor has revealed that orders from its major clients have been steady in the second quarter of 2012, which will ensure its revenues...
Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw first-quarter 2012 revenues reach NT$330 million (US$11.3 million), up 25.7% on...
Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, expects its revenues to increase 15-20% sequentially in the first quarter of 2012...
Semiconductor test and packaging service provider STATS ChipPAC now expects its revenues to register a 9-11% sequential decline in the first quarter of 2012, citing weaker-than-expected...
STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...
Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its January revenues rise 9% sequentially buoyed by a pull-in of orders for logic...
STATS ChipPAC has announced that the company will not resume assembly operations in its Thailand plant due to extensive equipment and facility damage beyond economic restoration....
