Taiwan-based IC testing specialists including King Yuan Electronics (KYEC) and Ardentec are likely to see their first-quarter revenues decrease 5-10% sequentially affected by clients'...
STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...
Revenues at STATS ChipPAC Taiwan Semiconductor are expected to register slight sequential growth in the first quarter of 2012, thanks to a pull-in of testing orders for logic ICs...
STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...
Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...
STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...
Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...
STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...
King Yuan Electronics (KYEC) and STATS ChipPAC Taiwan Semiconductor (SCT), providers of IC testing services, saw net profits for the second quarter of 2011 drop 52.0% and 31.0% seq...
The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...
IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...
STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits soared to US$108 million in 2010 from US$10.1 million in 2009....
