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NEWS TAGGED STATS CHIPPAC
Tuesday 18 January 2011
STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan
STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...
Thursday 16 December 2010
STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices
STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...
Tuesday 14 December 2010
STATS ChipPAC sees over 50% growth in flip chip business
STATS ChipPAC has seen its flip chip business grow more than 50% in 2010 compared to 2009, according to the company, adding that shipments of flip chip packages have surpassed 250...
Friday 3 December 2010
Ardentec denies merger with STATS ChipPAC
Wafer probing service provider Ardentec has denied a Chinese-language Economic Daily News (EDN) report indicating STATS ChipPAC has approached it to discuss a merger, according...
Thursday 2 December 2010
STATS ChipPAC increasing copper-wire bonding output
Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to...
Monday 29 November 2010
MediaTek reportedly negotiating new prices with UMC and backend service providers
MediaTek is reportedly negotiating with United Microelectronics Corporation (UMC) as well as backend service providers including Advanced Semiconductor Engineering (ASE) and Siliconware...
Wednesday 15 September 2010
STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Tuesday 13 April 2010
STATS ChipPAC intros 300mm embedded WLB wafer manufacturing
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
Tuesday 15 December 2009
TSMC to raise orders to testing partners, says paper
Taiwan Semiconductor Manufacturing Company (TSMC) plans to no longer add new capacity for wafer testing, and increase its outsourcing to backend partners Ardentec and STATS ChipPAC...
Wednesday 25 November 2009
STATS ChipPAC moves copper wire bonding process to volume production
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Thursday 29 October 2009
SPIL says 2010 capex to double
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
Thursday 1 October 2009
ASE ramping copper wire bonding output
Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...
Monday 3 August 2009
Top backend houses to see revenues grow in 3Q09
Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...
Thursday 30 July 2009
STATS ChipPAC sales up 45% in 2Q09; swings to profit
STATS ChipPAC saw its net sales grow 45% sequentially in the second quarter of 2009, and managed to swing back to profitability, according to the company. The Singapore-based chip...
Wednesday 17 June 2009
STATS ChipPAC expanding capacity for wafer-level packaging
STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...