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Thursday 23 September 2021
Nan Ya to scale up ABF substrate output for AMD processors
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which...
Thursday 23 September 2021
ABF substrate supply to remain constrained in 2022
Due to spec upgrades of new processors and growing difficulty in producing high-end ABF substrates with satisfactory yield rates, the world's actual ABF substrate supply growth could...
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Friday 17 September 2021
AiP substrate shipments for new iPhones set to rise
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Friday 10 September 2021
Unimicron reports record August revenue
IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.
Wednesday 8 September 2021
Kinsus to enjoy sales growth through 4Q21
IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...
Tuesday 7 September 2021
Taiwan CCL makers post double-digit revenue increases in August
Copper-clad laminate (CCL) makers including Elite Material (EMC), Iteq, Taiwan Union Technology (TUC) and Ventec Electronics all saw their revenues register double-digit on-year increases...
Tuesday 7 September 2021
Nan Ya PCB to enjoy sales growth through 4Q21
Taiwan-based IC substrate maker Nan Ya PCB is poised to generate sequential revenue increases through the fourth quarter of 2021, as robust ABF-based as well as BT substrate demand...
Wednesday 1 September 2021
Robust HDI PCB demand for high-end applications fueling capacity expansions
HDI PCB demand has been robust for high-end applications, and major makers including Unimicron Technology, Compeq Manufacturing, and Tripod Technology are planning to enforce capacity...
Tuesday 31 August 2021
IC substrate suppliers to see rising ASPs boost 2021 profits
IC substrate suppliers are expected to see ABF- and BT-based substrate ASPs rise about 20% and 10%, respectively, in 2021, which will bolster their profit performance for the year,...
Monday 30 August 2021
BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22
BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...
Monday 30 August 2021
NAND flash controller prices to rise in 4Q21
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
Friday 27 August 2021
ABF substrate suppliers see more customers seek long-term deals
ABF substrate makers have seen more of their customers eager to strike long-term agreements to ensure sufficient supplies through 2025 and even beyond, as tight supply is expected...
Thursday 26 August 2021
UVAT enjoys robust demand for advanced packaging, substrate production
Taiwan-based UVAT Technology, a supplier of etching and sputtering equipment, expects robust demand for advanced packaging and ABF substrate manufacturing to drive its revenue growth...