The shortage of ABF substrates is worsening further as demand continues to grow at a faster pace than expected, and the supply crunch will persist throughout 2023 and may even last...
As chipmakers continue to ramp up production of large-size HPC chips to meet the ever-rising requirements for computing power, IC substrate makers are all stepping up capacity expansion...
With PCB and IC substrate suppliers looking to expand capacity, related equipment suppliers will be busy fulfilling orders that will be ramping up substantially through 2022, according...
Taiwan-based IC substrate suppliers, such as Unimicron Technology, have reportedly cut into the supply chain for Apple's custom-built silicon powering the next generation Macs, and...
Taiwan-based Symtek Automation Asia (SAA), which provides automated equipment to support capacity expansions at PCB and IC substrate makers, has seen the visibility of customer orders...
PCB and IC substrate supplier Nan Ya PCB saw its September revenue drop 4.6% sequentially due to the impact of power restrictions imposed by the local government on its plant in Kunshan,...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Taiwan-based makers with factory operations in Kunshan of China's Jiangsu provinces were notified on October 5 by the local government about immediate power cuts, and have expressed...
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which...
Due to spec upgrades of new processors and growing difficulty in producing high-end ABF substrates with satisfactory yield rates, the world's actual ABF substrate supply growth could...
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...
