Nan Ya Plastics expects to enjoy more robust growth in sales of its copper foil and other electronic materials in the second half of 2021, while seeking more vertical integration...
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Taiwan-based leading PCB maker Zhen Ding Technology and Austria's AT&S are set to enter the high-end ABF substrate segment where demand will stay robust through 2025, both making...
Taiwan-based Leatec Fine Ceramic, a dedicated maker of aluminum and ceramic substrates needed for manufacturing chip resistors, has expressed optimism about its operations in the...
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
ABF substrate prices are likely to rise quarter by quarter in the second half of the year, as demand for such substrates continues to outgrow new capacity supply, according to industry...
Symtek Automation Asia (SAA), an automated semiconductor equipment supplier, has seen its first-tier customers raise capital spending in a bid to push their development of 5G and...
Taiwan's PCB and IC substrate specialist Unimicron Technology has posted record revenues for June and first-half 2021, and is expected to perform even better in the second half of...
Taiwan's PCB maker Zhen Ding Technology has disclosed plans to set up four new plants in Taiwan and China in 2021, mostly dedicated to production of high-end IC substrates and rigid...
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
IC substrate makers continue to see their output fall short of demand, despite a recent slowdown in cryptomining demand, according to industry sources.
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
