Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all posted both sequential and on-year increases for their April revenues, and are poised to embrace brisk...
Taiwan's leading PCB maker Zhen Ding Technology will see its 2021 capex grow slightly on year to a new high of over NT$22 billion (US$785.71 million) for building new capacity for...
The supply of BT substrates has been increasingly tight, as more vendors of chips, particularly cryptomining ASICs, have turned to adopt BT substrates amid worsening shortages of...
Suppliers including foundry TSMC are expected to kick off production for the redesign of Sony's PlayStation 5 (PS5) games console between the second and third quarters of 2022, according...
Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...
Unimicron Technology has obtained funds from the local government in Kunshan, China for relocating its manufacturing operations locally out of environmental concerns, and will have...
Ibiden has announced plans to inject JPY180 billion (US$1.66 billion) into the expansion of production capacity for high-end IC substrates for applications such as servers and image...
IC substrate maker Kinsus Interconnect Technology expects ABF substrate shipments to grow to 35% in terms of revenue contribution ratio in 2021, when at least a 30% additional production...
With Corning and AU Optronics (AUO) planning to undertake annual maintenance for their fabs shortly, the current tight supply of glass substrates and LCD panels is likely to worsen...
Demand for mmWave AiP modules is set to pick up significantly in the second half of 2021 as Apple is expected to boost the adoption of such modules in its new Phones, which in turn...
ABF substrate prices still have room for further growth in 2021 to reflect rising costs of upstream components and materials, according to industry sources.
MediaTek has stepped up its purchases of BT substrates for use in its 5G mobile SoCs from suppliers including Unimicron Technology and Kinsus Interconnect Technology, as part of its...
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
Nan Ya PCB and Kinsus Interconnect Technology are both poised to expand capacity for ABF substrates with additional output set to come online later this year, according to industry...
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
