The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Corning has disclosed plans to hike its display glass substrate prices in the second quarter of 2021 to reflect increased costs in logistics, energy, raw materials and other operational...
Taiwan-based PCB and IC substrate companies are poised to enjoy a particularly strong first half of 2021, thanks to robust demand for high-end substrates and HDI boards, according...
Taiwan's PCB makers in the supply chain of AirPods are prepared to kick off mass production of flexible PCB (FPCB) and SiP substrates for the third-generation AirPods slated to be...
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
IC substrate maker LG Innotek is bracing for production of ABF-based FCBGA substrates, according to Korean media reports, but industry sources believe it would be a hard job to venture...
Taiwan's IC substrate makers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are upbeat about their revenue and profit results for first-quarter 2021 due to rising...
Shennan Circuits has focused more on automotive PCBs and IC substrates following shrinkages in shipments for 5G infrastructure applications in 2020, according to the China-based PCB...
Taiwan's IC substrate maker Unimicron Technology has decided to lease a land lot in northern Taiwan to prepare for further capacity expansions beyond those already underway, expecting...
Taiwan's IC substrate makers with their strong technological prowess are in pole position to explore business opportunities from China's ongoing homegrown CPU development campaign,...
Tight supply for ABF substrates may ease in 2023 at the earliest if makers in Taiwan, Japan and Korea can smoothly commercialize their new capacity with stable yield rates in 2022...
Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
The global supply of ABF substrates may fall short of demand by at least 25% in 2021, due mainly to limited capacity expansions despite increasing demand, according to industry sou...
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
