IC substrate maker Kinsus Interconnect Technology expects ABF substrate shipments to grow to 35% in terms of revenue contribution ratio in 2021, when at least a 30% additional production...
With Corning and AU Optronics (AUO) planning to undertake annual maintenance for their fabs shortly, the current tight supply of glass substrates and LCD panels is likely to worsen...
Demand for mmWave AiP modules is set to pick up significantly in the second half of 2021 as Apple is expected to boost the adoption of such modules in its new Phones, which in turn...
ABF substrate prices still have room for further growth in 2021 to reflect rising costs of upstream components and materials, according to industry sources.
MediaTek has stepped up its purchases of BT substrates for use in its 5G mobile SoCs from suppliers including Unimicron Technology and Kinsus Interconnect Technology, as part of its...
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
Nan Ya PCB and Kinsus Interconnect Technology are both poised to expand capacity for ABF substrates with additional output set to come online later this year, according to industry...
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Corning has disclosed plans to hike its display glass substrate prices in the second quarter of 2021 to reflect increased costs in logistics, energy, raw materials and other operational...
Taiwan-based PCB and IC substrate companies are poised to enjoy a particularly strong first half of 2021, thanks to robust demand for high-end substrates and HDI boards, according...
Taiwan's PCB makers in the supply chain of AirPods are prepared to kick off mass production of flexible PCB (FPCB) and SiP substrates for the third-generation AirPods slated to be...
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
IC substrate maker LG Innotek is bracing for production of ABF-based FCBGA substrates, according to Korean media reports, but industry sources believe it would be a hard job to venture...
Taiwan's IC substrate makers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are upbeat about their revenue and profit results for first-quarter 2021 due to rising...
