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Monday 9 September 2024
High-NA EUV adoption hampered by cost, mass-production on track for 2026
Despite ASML being the sole provider of high-NA EUV systems, customer adoption is affected by the high price, as ASML aims to begin mass production of the system by 2026.
Monday 9 September 2024
Samsung and SK Hynix vie for HBM dominance as both advance 16-layer technology
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Friday 6 September 2024
Power consumption is main issue for AI development, says SK Hynix president Justin Kim
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Friday 6 September 2024
Foxconn evaluates European semiconductor packaging plant, continues advanced technology development
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
Friday 6 September 2024
PCIM Asia 2024: global giants lead, as Chinese SiC supply chain gains momentum
PCIM Asia 2024 recently kicked off in Shenzhen, China, gathering a diverse array of international and Chinese firms focused on power semiconductors. The event prominently featured...
Friday 6 September 2024
ASE establishes SiPhIA consortium, CEO Tien Wu sees accelerated progress in silicon photonics
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Friday 6 September 2024
UK auto industry shifts focus to net-zero as EV revolution gathers pace
Ahead of the UK Low Carbon Vehicle (LCV) event, Julian Hetherington, Director of the Advanced Propulsion Centre (APC), provided an early preview of the electric and energy-efficient...
Friday 6 September 2024
South Korean battery equipment business CIS announces merger with SNU Precision
South Korean battery equipment business CIS has announced its plan to merge with affiliate SNU Precision. As SFA is the largest shareholder for both companies, other related affiliated...
Friday 6 September 2024
Chinese OSATs continue stepping up high-end packaging deployment
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
Friday 6 September 2024
BOE reportedly seeks to mass-produce glass substrates for semiconductor packaging in 2026
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
Thursday 5 September 2024
PlayNitride sees 2Q24 gross margins explode; chairman highlights when Micro LED will become cheaper than OLED
PlayNitride chairman Charles Li stated that the development of Micro LED technology will rapidly drive down costs at a pace similar to Moore's Law, with costs expected to fall below...
Thursday 5 September 2024
No longer just a chip supplier, Nvidia expands one-stop service into AI factory
In the current AI development trend, Nvidia is already dominating the leading position in the AI chip market and actively expanding its influence to data centers and related areas...
Thursday 5 September 2024
UK semiconductor delegation eyes closer collaboration with Taiwan at SEMICON
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in...
Thursday 5 September 2024
CHPT's AI initiative drives revenue growth and innovation in chip-testing solutions
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
Thursday 5 September 2024
Taiwan's RF and baseband 6G chips entering tapeout by 2025
Since carriers adopted 5G, the technology has not stopped evolving. For example, the 5G Advanced Network Solutions and the research and development of radio frequency (RF) and baseband...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research