Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...
Despite a recent downturn in the overall automotive market, suppliers of automotive components have reported a rise in revenue. This trend is particularly pronounced in the automotive...
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
As the world enters the AI era for mobile devices, Samsung Display (SDC) and LG Display (LGD) both express optimism about the outlook of OLED technology. According to Lee...
Apollo Go, developed by Baidu, has been making significant strides in the autonomous vehicle industry, particularly following its operation in Wuhan, China, which brings the concept...
Taiwan-based Adata Technology has partnered with Advantech to develop an AI Autonomous Mobile Robot (AMR) using Nvidia's Nova Orin. This advanced AMR integrates upper and lower computers...
US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology,...
