On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Zettabyte, an AI data center technology provider, and Wistron have announced a strategic partnership to develop Taiwan's first hyperscale AI data center.
Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound se...
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Merck continues to increase its investment in Taiwan, believing that essential materials are the most lacking element in Taiwan's AI industry supply chain and that it is well-positioned...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
Iris Optronics, a cholesteric liquid crystal display (ChLCD) technology provider, has established its first overseas subsidiary in Qingpu District, Shanghai.
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
SEMICON Taiwan 2024 will feature more than 1,000 firms and up to 3,700 booths, including Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix.
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
As electronic products demand higher power density, driven by rising energy needs, third-generation semiconductors have become crucial. Among these, silicon carbide (SiC), known for...
Rohm Semiconductor has announced the use of power modules equipped with the company's fourth-generation SiC MOSFET bare chips for traction inverters in three ZEEKR EV models manufactured...
