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NEWS TAGGED WIRE BONDING
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Wednesday 23 December 2020
CWTC readies NT$10 billion for leadframe capacity expansions, acquisitions
Leadframe maker Chang Wah Technology (CWTC) has readied NT$10 billion (US$355.05 million) in new funds, including a 5-year syndicated loan of NT$7.2 billion (US$255.6 million) newly...
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Thursday 17 December 2020
ASE to set up more smart factories in 2021
ASE Group will complete the establishment of its 18th smart factory by the end of this year, with plans to build seven more intelligent plants in 2021, according to company COO Tien...
Tuesday 15 December 2020
Taiwan backend houses see more demand for consumer power chips
Taiwan-based power IC backend specialists including Greatek Electronics, GEM Services and Lingsen Precision Industries have seen a ramp-up in packaging demand for consumer devices...
Monday 7 December 2020
Taiwan backend houses see orders boom
Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Friday 4 December 2020
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
Thursday 3 December 2020
ASE obtains FC packaging orders for new Qualcomm 5G SoC
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Wednesday 2 December 2020
Backend quotes rising may not be entirely good for OSATs
Raising backend service quotes is not necessarily the best practice for OSAT firms to counter ever-tighter capacity supply for wire bonding and flip chip packaging, as nothing is...
Friday 27 November 2020
ASE, Greatek see QFN wire bonding run at full capacity for PMICs
IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...
Wednesday 25 November 2020
Memory backend houses raise quotes on rising gold costs
Taiwan-based memory backend houses have raised their quotes for wire bonding to reflect rising raw materials costs, according to industry sources.
Friday 20 November 2020
Pandemic-triggered structural changes: Q&A with ASE Technology COO Tien Wu
ASE Technology has turned optimistic about the IC backend industry prospects for the first half of 2021 with high capacity utilization to linger in diverse processes despite the coronavirus...
Tuesday 10 November 2020
Leadframe supplier CWTC posts profit increase
Chang Wah Technology (CWTC) has reported net profits rose 34% on year to NT$603 million (US$21.1 million) in the first three quarters of 2020, with EPS reaching NT$1.71 for the period,...
Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Monday 19 October 2020
Taiwan IC backend service firms ramping wire bonding capacity
The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog...