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NEWS TAGGED WIRE BONDING
Friday 4 March 2011
SPIL sees boost in copper wirebonding orders, says paper
With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
Thursday 27 January 2011
SPIL 4Q10 gross margin up on higher copper wire bonding sales
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
Thursday 23 September 2010
ASE slowing copper wire bonding expansion, says paper
Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...
Tuesday 3 August 2010
SPIL announces equipment purchase
Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.
Thursday 17 June 2010
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Tuesday 15 June 2010
ASE raises 2010 capex
Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
Tuesday 18 May 2010
Backend supplier UTAC says sales of copper wirebonding process growing
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
Thursday 11 February 2010
Greatek and TICP to step into copper-wire bonding in 2Q10
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
Wednesday 25 November 2009
STATS ChipPAC moves copper wire bonding process to volume production
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Tuesday 10 November 2009
ASE and SPIL revenues hit 2-year high in October
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...
Monday 2 November 2009
ASE, SPIL speeding up copper wire bonding expansion
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Friday 16 October 2009
ASE and SPIL deny headhunting rumors
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
Wednesday 8 July 2009
SPIL 2Q09 sales up more than 50%
Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...
Tuesday 2 June 2009
ASE, SPIL optimistic about 3Q09
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
Wednesday 20 May 2009
STATS ChipPAC delivers low-cost flip-chip technology
STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...