With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...
Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...
