ASE Technology Holding has announced that Siliconware Electronics (Fujian), a wholly-owned subsidiary in China of its member firm Siliconware Precision Industries (SPIL), has been...
Demand for mini LED-backlit display solutions is expected to take off in 2021 with leading system vendors such as Apple and Samsung keenly adopting the solutions in their terminal...
Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
With a 22% share of the global semiconductor market, Taiwan's IC industry must capture the right to speak for its future business development while embracing the 60th anniversary...
While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's...
The global semiconductor materials market increased 3% in 2014 compared to 2013, while worldwide semiconductor revenues increased 10%, according to SEMI. Revenues of US$44.3 billion...
Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...
Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...
Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...
Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...
