A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are expected to begin...
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
TSMC at its upcoming technology symposiums will disclose more details about the foundry's 3nm and 2nm process nodes, and advanced 3D heterogeneous integration technology, such as...
Chinese chipmakers including Lansus Technologies, MeidaTek-affiliate Vanchip Technology, and Unisoc Communications under the Tsinghua Unigroup are keenly developing 5G RF-FEM products...
Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...
Taiwan-based E&R Engineering has enjoyed a surge in wafer-level laser cutting equipment orders from major chipmakers recently and also begun investing in R&D of equipment...
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...
ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment...
Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo)...
