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Friday 30 August 2024
Nvidia supply chain, including TSMC, has strong order visibility for AI chips
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
Thursday 29 August 2024
Macnica Anstek eyes 2024 rebound amid strong CoWoS and AMD Edge computing demand
Electronic component distributor Macnica Anstek reported steady orders for automated testing in the second half of 2024, benefiting from strong CoWoS demand. The company expects its...
Thursday 29 August 2024
Panel-level packaging looks promising
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
Wednesday 28 August 2024
Nvidia's upcoming results expected to surpass expectation
Nvidia will release its fiscal second-quarter financial results on August 28. The market has high expectations for the company, anticipating revenue and gross margin figures to exceed...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Thursday 22 August 2024
EgisTec exploring cloud AI prospects
Taiwanese IC design company Egis Technology (EgisTec) is actively exploring innovative opportunities in the cloud AI market through a collaboration with Arm.
Tuesday 20 August 2024
FOPLP v CoWoS: the next frontier for advanced chip packaging
As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.
Tuesday 20 August 2024
Is TSMC-Innolux FOPLP collaboration possible?
TSMC recently acquired Innolux's 5.5G LCD fab at the Southern Taiwan Science Park (STSP) for NT$17.14 billion (US$530.8 million), which includes factory buildings and associated facilities...
Tuesday 20 August 2024
TSMC places SHR orders with fab toolmakers
TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Friday 16 August 2024
Daxin develops chipmaking materials for 2nm, CoWoS
Daxin Materials, which provides specialty chemicals for semiconductor, display, and key raw materials, has developed chipmaking materials supporting advanced 2nm manufacturing processes...
Friday 16 August 2024
Topco Scientific continues to promote advanced packaging materials
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
Friday 16 August 2024
TSMC to see CoWoS production capacity reach 60,000 wafers in 2025
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Thursday 15 August 2024
FitTech bets on advanced packaging, silicon photonics CPO to drive 2025 growth
LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024.
Thursday 15 August 2024
Cloud GPU growth to stabilize in 2025 after rapid increase
Cloud GPUs have seen massive growth under the current AI boom, with the annual growth rate of high-end cloud GPUs in 2024 to reach 217% if both supply and demand hold steady, says...
Thursday 15 August 2024
Taiwan's semiconductor industry unites for SEMICON 2024, spotlighting AI technologies
The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.