Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK...
The Artificial Intelligence (AI) frenzy intensifies the competition for High Bandwidth Memory (HBM). A South Korean court recently approved an order application by SK Hynix to prohibit...
Wuhan Xinxin Semiconductor Manufacturing (XMC) reportedly has sent out an invitation to bid for a high-bandwidth memory (HBM) project. This suggests that the Chinese memory sector,...
Penetration of DDR5 in the memory market is poised to accelerate and reach double digits in the second half of 2024, thanks to demand from Generative AI (GenAI), according to market...
The DRAM market demand is picking up, and Samsung Electronics and SK Hynix, which previously adopted a production reduction strategy, have recently shown signs of resuming equipment...
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...
Micron Technology has begun volume production of its HBM3E memory. Nvidia H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024, will include Micron's...
SK Hynix is reported to commence mass production of the fifth-generation High Bandwidth Memory (HBM) HBM3E in March 2024, once again leaping ahead of competitors Samsung Electronics...
