Foxconn is enhancing its development blueprint for its smart factory platform. Intrinsic CEO Wendy Tan White made an appearance at Hon Hai Tech Day (HHTD24) to discuss the deep collaborative...
AUO and Sino-American Silicon Products (SAS) have collaborated to launch large-format, double-glass, bifacial solar modules with high-efficiency output, successfully securing the...
Foxconn is redefining smart manufacturing and aiming for a future where AI produces AI. Foxconn's two-day Hon Hai Tech Day (HHTD24) event began on October 8, during which it unveiled...
As large language models (LLMs) evolve, investment in artificial intelligence (AI) infrastructure is poised for significant growth, according to Foxconn Chairman Young Liu in a recent...
As Taiwan accelerates its green energy agenda, Taiwan Perovskite Research and Industry Association Chairman Lai-Ju Chen highlights perovskite cells as the technology set to transform...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
Taiwanese developer Taiya Renewable Energy has partnered with French floating wind specialist BW Ideol, demonstrating advanced typhoon-resistant technology at the 2024 Energy Taiwan...
SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...
Hon Hai (Foxconn) is holding the 2024 Hon Hai Tech Day on October 8-9. Foxconn chairman Young Liu said the company commits to becoming the most trusted partner in the industry by...
The upcoming 21st TAITA-SV Annual Conference, scheduled for Saturday, October 19, 2024, at the Hyatt Regency Hotel in Santa Clara, California, will focus on the theme "Taiwan's Strategic...
The explosive rise of generative AI has led to a reimagining of the fledgling metaverse industry, which has seen renewed interest with Meta's prototype Orion glasses, launched at...
Jarllytec, a specialist in bearings and hinge technology, expects a significant increase in orders for foldable smartphone models from its Chinese clients starting in October. This...
The AI server rack featuring Nvidia's Blackwell chip will begin mass production in the fourth quarter of 2024, which is expected to increase the percentage of liquid cooling solutions...
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
