PCIM Asia 2024 recently kicked off in Shenzhen, China, gathering a diverse array of international and Chinese firms focused on power semiconductors. The event prominently featured...
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Ahead of the UK Low Carbon Vehicle (LCV) event, Julian Hetherington, Director of the Advanced Propulsion Centre (APC), provided an early preview of the electric and energy-efficient...
South Korean battery equipment business CIS has announced its plan to merge with affiliate SNU Precision. As SFA is the largest shareholder for both companies, other related affiliated...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
PlayNitride chairman Charles Li stated that the development of Micro LED technology will rapidly drive down costs at a pace similar to Moore's Law, with costs expected to fall below...
In the current AI development trend, Nvidia is already dominating the leading position in the AI chip market and actively expanding its influence to data centers and related areas...
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in...
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
Since carriers adopted 5G, the technology has not stopped evolving. For example, the 5G Advanced Network Solutions and the research and development of radio frequency (RF) and baseband...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Zettabyte, an AI data center technology provider, and Wistron have announced a strategic partnership to develop Taiwan's first hyperscale AI data center.
Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound se...
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
