Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Taiwan-based makers with factory operations in Kunshan of China's Jiangsu provinces were notified on October 5 by the local government about immediate power cuts, and have expressed...
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which...
Due to spec upgrades of new processors and growing difficulty in producing high-end ABF substrates with satisfactory yield rates, the world's actual ABF substrate supply growth could...
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...
Copper-clad laminate (CCL) makers including Elite Material (EMC), Iteq, Taiwan Union Technology (TUC) and Ventec Electronics all saw their revenues register double-digit on-year increases...
Taiwan-based IC substrate maker Nan Ya PCB is poised to generate sequential revenue increases through the fourth quarter of 2021, as robust ABF-based as well as BT substrate demand...
HDI PCB demand has been robust for high-end applications, and major makers including Unimicron Technology, Compeq Manufacturing, and Tripod Technology are planning to enforce capacity...
IC substrate suppliers are expected to see ABF- and BT-based substrate ASPs rise about 20% and 10%, respectively, in 2021, which will bolster their profit performance for the year,...
BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
