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NEWS TAGGED MEMORY CHIPS
Tuesday 16 July 2024
Server HBM, DDR5 demand to stay high until 2025, says distributor Supreme Electronics
Demand for High-Bandwidth Memory (HBM) and DDR5 RAM for servers has steadily risen as Cloud Service Providers (CSP) in North America continue building data centers, with IC distributor...
Tuesday 16 July 2024
Samsung HBM3E to obtain verification for volume shipments, say sources
Samsung Electronics' HBM3E memory will soon obtain verification for volume shipments, potentially limiting the vendor's supply of DDR5 and other memory chips, according to industry...
Monday 15 July 2024
JEDEC nears HBM4 standard finalization
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Monday 15 July 2024
Samsung leverages IDM status to differentiate HBM4 with optimal customization and performance gains
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Monday 15 July 2024
Micron CEO meets Taiwan President, secures government support for local operations
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
Monday 15 July 2024
Memory module firm AGI expects significant growth in 2024
Agile Gear International (AGI), a Taiwan-based memory module company founded in 2018, expects a significant surge in sales this year.
Friday 12 July 2024
Samsung bolsters South Korean AI, HPC chip design with expanded DSP support and advanced process technologies
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
Friday 12 July 2024
SK Hynix ramps up talent recruitment to strengthen HBM4 competitiveness
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
Thursday 11 July 2024
Nanya likely to break even in 3Q24 as inventory improves
Nanya Technology's DDR4 inventory adjustment will improve quarter after quarter, bringing total fab utilization to more than 90%, according to the Taiwan-based DRAM memory maker.
Wednesday 10 July 2024
Silicon Motion expects 2Q24 sales to beat guidance
Silicon Motion Technology, a manufacturer of NAND flash controllers for solid-state storage devices, has announced that based on preliminary second-quarter financial results, sequential...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Semiconductor manufacturing equipment growth to set new high in 2025: SEMI
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4%...
Wednesday 10 July 2024
Rising HBM demand to benefit SK Hynix supplier in China
Yoke Technology, a China-based semiconductor and chemical material supplier, has disclosed its preliminary financial results for the first half of 2024. The company expects a net...
Wednesday 10 July 2024
Samsung reportedly adopts Mo in 3D NAND, to reshape memory industry
Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.
Wednesday 10 July 2024
US to invest up to US$1.6 billion to award domestic semiconductor advanced packaging R&D efforts
On July 9, the US Department of Commerce issued a Notice...