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Friday 26 July 2024
Samsung bets big on CXL for next-gen memory leadership
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
Thursday 25 July 2024
Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Thursday 25 July 2024
Rising memory prices, AI demand boost SK Hynix 2Q24 sales and profit
SK Hynix has reported revenue hit an all-time high of KRW16.42 trillion (US$11.8 billion) in the second quarter of 2024, when operating profits topped KRW5 trillion for the first...
Wednesday 24 July 2024
Samsung HBM3 and HBM3E still pending Nvidia quality tests
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Tuesday 23 July 2024
ASML looks to expand staff in Japan thanks to rising local EUV demand
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
Friday 19 July 2024
Samsung memory goes full throttle, advances 3D and LLW DRAM
As the AI era unfolds, the demand for memory solutions that maximize performance while minimizing power consumption is growing exponentially. Samsung Electronics is reportedly developing...
Wednesday 17 July 2024
HBM4 poised to revolutionize memory performance in HPC applications
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
Wednesday 17 July 2024
Samsung latest LPDDR5 DRAM validated for use with Dimensity 9400
Samsung Electronics has announced that its latest LPDDR5X DRAM has been verified for use in MediaTek's upcoming Dimensity 9400, according to an official statement and a report from...
Tuesday 16 July 2024
Samsung and SK Hynix stack LPDDR DRAMs to cut AI power consumption
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.
Tuesday 16 July 2024
Memory prices to rise at slower pace in 3Q24
DRAM and NAND flash memory prices will continue to rise in the third quarter, albeit at a slower rate than in the first half of this year, as market circumstances improve more, according...
Tuesday 16 July 2024
Samsung HBM3E to obtain verification for volume shipments, say sources
Samsung Electronics' HBM3E memory will soon obtain verification for volume shipments, potentially limiting the vendor's supply of DDR5 and other memory chips, according to industry...
Monday 15 July 2024
JEDEC nears HBM4 standard finalization
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Monday 15 July 2024
Micron CEO meets Taiwan President, secures government support for local operations
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
Friday 12 July 2024
SK Hynix ramps up talent recruitment to strengthen HBM4 competitiveness
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
Thursday 11 July 2024
Nanya likely to break even in 3Q24 as inventory improves
Nanya Technology's DDR4 inventory adjustment will improve quarter after quarter, bringing total fab utilization to more than 90%, according to the Taiwan-based DRAM memory maker.