According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
As a result of the high demand for advanced packaging materials in 2024, IC packaging material distributors such as Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific,...
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Semiconductor materials distributor Topco Scientific has followed in the footsteps of its foundry partners by establishing operations overseas, according to Jeffery Pan, chairman...
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Niching Industrial, a distributor of IC packaging materials, sees clear order visibility for heat sinks thanks to brisk demand for midrange and high-end logic IC packaging.
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
