System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server...
Some Taiwan-based diode and MCU suppliers have extended their chip offerings for niche markets, such as middle- to high-end high-speed transmission, high-performance computing, and...
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Despite chip demand showing signs of a downturn since the start of 2022, the capacity expansion spree at foundry houses seems unstoppable, sparking concerns that overcapacity may...
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Computex 2022 has kicked off in Taipei, with the focus this year on the metaverse, ESG (environmental, social, and governance), high-performance computing (HPC), AI, and 5G-related...
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...
On the first day of the Intel Vision 2022 event on May 10, Intel revealed an early look at the "Intel On Demandservice," offering to help enterprises meet the needs...
IC test interface solutions provider Chunghwa Precision Test Tech (CHPT) has newly landed MEMS probe card orders for smartphone chips from Asia-based customers, with volume production...
High-performance computing technology has been widely adopted in advanced countries to facilitate technological innovation, commercial big-data analytics, and aerospace missions....
Taiwan-based OSAT ASE Technology expects demand for automotive, HPC and network ICs to stay robust and buoy further its sales performance in the second quarter and the second half...
