Taiwan-based WinWay Technology, a dedicated supplier of IC test interface solutions, has plans to expand production capacity for high-frequency and high-speed IC test sockets in 2021...

The impact of Huawei's woes on its Taiwan-based chip suppliers has been smaller than expected, according to industry sources.

Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to US$59.6 billion in 2019 and register a new industry...

The worsening shortages of ABF substrates are expected to become one of the major woes affecting shipments of new CPU and GPU products at chipmakers in 2021, according to industry...

Passive component maker Walsin Technology has disclosed plans to expand production capacity for LTCC filters and automotive MLCCs next year at its manufacturing facilities in Kaohsiung,...

Foxconn Technology Group (Hon Hai Precision Industry) has disclosed it is developing manufacturing capability catering to local needs for datacenters and high performance computing...

Apaq Technology saw its cumulative 2020 revenue through October rise 26.8% on year, thanks to robust orders for motherboards, graphics cards and game consoles. The solid electrolytic...

Thanks to high capacity utilization at foundry and backend houses, IC materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all optimistic...

A new wave of price hikes for high-end IC substrates, ranging from 20-40%, has emerged following a recent fire damaging a plant of Taiwan's Unimicron Technology, with clients rushing...

Taiwan's PCB leader Zhen Ding Technology has completed its acquisition of local peer BoardTek Electronics as a wholly-owned subsidiary, which specializes in high-frequency rigid boards...

IC testing solution provider Chunghwa Precision Test Tech (CHPT) and 3D sensor components packager Xintec have posted impressive revenue gains for the first three quarters of 2020...

Samsung Electronics expects profit to decline in the fourth quarter amid weakening memory chip demand from server customers and intensifying competition in mobile phones and consumer...

TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...

TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according...