Taiwan's government is urging local IC design houses to speed up their migration to advanced semiconductor manufacturing processes to avoid cut-throat pricing competition from China...
AMD will launch a new generation of MI325X chips utilizing HBM3E in October to enhance its standing in the AI GPU market, aiming to secure orders from AI server clients seeking to...
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
China's latest domestically produced DUV exposure machine cannot perform the critical multiple exposures needed for advanced chip production, making it incapable of achieving finer...
Originally one of the regulated export destinations for US chips, Saudi Arabia aims to receive clearance from the US government in 2025 and obtain US-manufactured high-quality chip...
USB4 adoption is rapidly gaining traction in the consumer electronics market, with PCs featuring AI functionality now coming equipped with multiple USB4 ports. For Taiwanese firms...
China's Ministry of Industry and Information Technology (MIIT) has issued a directive urging automakers to audit their chip usage and push for chip replacement verifications, intending...
China recently achieved a milestone with its indigenous lithography system, which is capable of producing chips at nodes smaller than 65nm. However, the development of an immersive...
In early December 2022, Apple CEO Tim Cook and US President Joe Biden attended the groundbreaking ceremony for TSMC's wafer fab in Arizona. During his speech, Cook stated that the...
Chinese smartphone brand Vivo is set to officially launch its latest flagship smartphone, the Vivo X200, in October, featuring MediaTek's Dimensity 9400. Coupled with the recent reveal...
Winbond Electronics has grabbed 45nm NOR flash orders from Apple, with shipments kicking off in the third quarter, according to industry sources. The orders may help the Taiwan-based...
Apple is poised to equip iPhones with its self-developed 5G modem by 2025. The latest iPhone SE is expected to be the first recipient, potentially arriving as early as the first half...
As Tata Electronics constructs India's first commercial wafer fab in three decades, it plans to leverage this experience to develop additional fabs in the medium to long term. The...
Intel's subsidiary Mobileye has recently decided to stop internal research and development of self-driving automotive FMCW LiDAR. The LiDAR R&D department is expected to be closed...
