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NEWS TAGGED 300MM
Wednesday 15 November 2017
SMIC 3Q17 profits fall
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has announced revenues of US$769.7 million in the third quarter of 2017, up 2.5% sequentially but down...
Wednesday 25 October 2017
Globalfoundries to adopt EUV for 7nm FinFET
Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...
Friday 20 October 2017
IC makers maximize 300mm, 200mm wafer capacity, says IC Insights
With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The...
Thursday 12 October 2017
Pure-play foundries boosting presence in China
With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...
Wednesday 9 August 2017
Sumco to expand production capacity for 300mm silicon wafers
Sumco has announced plans to expand production capacity for 300mm silicon wafers by 110,000 units per month. The additional capacity is expected to come online in the first half of...
Wednesday 9 August 2017
SMIC expects up to 3% revenue growth in 3Q17
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post revenue growth of up to 3% sequentially in the third quarter of 2017, with gross margin...
Monday 31 July 2017
GlobalWafers strikes deal with Samsung, says report
Taiwan-based GlobalWafers has signed a 2-3 year deal with Samsung Electronics under which GlobalWafers will provide Samsung a certain amount of silicon wafers at no fixed purchased...
Tuesday 18 July 2017
Installed 8-inch fab capacity to rise through 2020, says SEMI
Installed 8-inch (200mm) fab capacity has increased since 2009, and will reach close to 5.4 million wafers per month (wpm) by the end of 2017, according to SEMI. By 2020, 200mm capacity...
Monday 17 July 2017
Globalfoundries and VeriSilicon to enable single-chip solution for next-gen IoT networks
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
Monday 10 July 2017
NSIG hires former MEMC CEO
China's National Silicon Industry Group (NSIG) has hired Nabeel Gareeb, former CEO of MEMC Electronic Materials, to help it establish a materials eco-system in China.
Tuesday 23 May 2017
Globalfoundries and Chengdu partner to expand FD-SOI ecosystem in China
Globalfoundries and the Chengdu municipality have announced an investment to spur innovation in China's semiconductor industry. The partners plan to build a FD-SOI ecosystem including...
Thursday 27 April 2017
UMC expects flat performance in 2Q17
United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...
Friday 14 April 2017
Global SOI market to increase at 29.1% CAGR of 29.1% over 2017-2022, says research firm
The SOI (silicon on insulator) market is expected to be valued at about US$1.86 billion by 2022, growing at a CAGR of 29.1% between 2017 and 2022, industry research and consulting...
Tuesday 14 March 2017
China 12-inch fab capacity set to boom
With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.
Friday 16 December 2016
Number of chipmakers using 300mm wafers less than half those using 200mm wafers, says IC Insights
Prior to 2008, 200mm wafers were used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm wafers,...