Mobile SoC specialist MediaTek saw its July revenue fall 15.5% sequentially to NT$40.36 billion (US$1.45 billion).

TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...

AMICCOM releases new sub-1GHz wireless transmitter SoC, named A9339. A9339 integrates RF transmitter whose performance is the same as A7339. It can be used to communicate with AMICCOM's...

The price spiral of 5G SoC solutions may come to an end soon due to the increasing availability of related chips, according to industry sources.

Qualcomm has made headway in the 5G mmWave solution market, securing related orders from many telecom operators and smartphone vendors in North America, Europe, Japan, Korea, India...

Synopsys' Fusion Design Platform has enabled Samsung Foundry to achieve first-pass silicon success for an advanced, high-performance and multi-subsystem SoC, validating the extended...

IC substrate and PCB supplier Unimicron Technology expects to sustain strong shipments throughout 2021, inspired by very clear order visibility for all its major product lines in...

With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...

NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...

AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.

Qualcomm's just-unveiled Snapdragon 778G chipset with integrated X52 5G modem is manufactured using TSMC's 6nm process technology, and is designed mainly for midrange 5G-capable Android...

SemiFive, a silicon design solutions provider, has joined the Arm ecosystem to accelerate the deployment of application-optimized custom SoC designs built on Arm technology. Through...

Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...

Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...