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Tuesday 21 April 2020
Taiwan IC firms see orders for 5G infrastructure pull in from China
Taiwan-based IC design houses have landed a pull-in of orders for 5G base-station and customer-premise equipment (CPE) from China, according to sources at Taiwan's IC distributors.
Thursday 9 April 2020
TSMC sees CoWoS packaging capacity utilization ramp up
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
Wednesday 8 April 2020
Nan Ya, Kinsus 1Q20 revenues spike on robust ABF substrate shipments
Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...
Tuesday 7 April 2020
ASE enters ZTE supply chain for 5G base station chips
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
Friday 20 March 2020
Nan Ya PCB swings to profit in 2019
Nan Ya PCB returned to profitability in 2019, thanks to strong shipments of its high-end ABF substrates and an influx of new orders for SiP substrates.
Tuesday 3 March 2020
TSMC, Broadcom enhance CoWoS platform with 2X reticle size interposer
TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle...
Tuesday 7 January 2020
Win Semi, VPEC poised to embrace robust 1Q20
GaAs IC foundry Win Semiconductors and Visual Photonics Epitaxy Company (VPEC), which manufactures epitaxial wafers, both saw revenues increase by over 20% in 2019 and are expected...
Thursday 2 January 2020
LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont
While 5G mmWave-related technologies are developing rampantly, US chemical materials giant DuPont has set eyes on promoting its LTCC (low temperature co-fired ceramic) solutions to...
Friday 20 December 2019
Semiconductor tech to be more important in future 5G and AI applications
While 5G and AI will dominate new emerging tech applications to create cash flows for enterprises in the next decade, relevant semiconductor materials and technologies will not only...
Thursday 19 December 2019
Unimicron, Nan Ya may serve Chinese CPU makers with advanced ABF substrates
While China's homegrown processor makers are gearing up to develop new-generation solutions to serve huge domestic PC replacement demand, Taiwan-based Unimicron Technology and Nan...
Wednesday 18 December 2019
Concerns about tender offer by competitor: Q&A with WT Microelectronics chairman Eric Cheng
Taiwan's leading IC distributor WPG has announced an open tender offer to acquire 30% of ordinary shares of its peer WT Microelectronics (WT). WPG has requested the Fair Trade Commission...
Tuesday 26 November 2019
WT Micro employees speak up against WPG acquisition bid
Taiwan-based WPG's recent unsolicited tender offer for buying 30% of fellow IC distributor WT Microelectronics shares has stoked strong opposition from the latter's employees.
Tuesday 12 November 2019
TWS earbud chip prices fall below US$1.50
Unit prices for SoC chips used in true wireless stereo (TWS) earbuds have fallen below US$1.50 recently, down from US$2.50-3 in the first quarter of 2019, amid growing presence of...
Wednesday 6 November 2019
Taiwan IC supply chain cautious about China 5G incentive
China has recently offered to allow Taiwan-based firms to join the country's 5G technology R&D, standards formulation, network construction and product test, but most Taiwanese...
Monday 14 October 2019
Unimicron, Na Ya 4Q19 revenues to grow on ABF substrates
Taiwan-based Unimicron and Na Ya PCB have both seen revenues for the third quarter of 2019 reach high levels thanks to robust shipments of ABF substrates, and the growth momentum...