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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 26 January 2021
Smart logistics vision for next 30 years: Q&A with WPG Holdings vice chairman Frank Yeh
COVID-19 and the US-China trade war have combined to accelerate a split of the global supply chain in two - namely a "G2" pattern with one serving China and the other the rest of...
Monday 25 January 2021
Highlights of the day: Notebook ODMs have strong outlook
Demand for notebooks remains robust, thanks to the stay-at-home economy. Notebook ODMs expect orders to be stable...
Monday 25 January 2021
CIS chip suppliers tapping lucrative automotive, surveillance sectors
CMOS image sensor (CIS) suppliers are shifting their marketing strategies to focus more on automotive and surveillance applications seeking to ramp up profitability, according to...
Monday 25 January 2021
Taiwan IC design houses slow new chip development due to foundry capacity shortage
Taiwan-based IC design houses, including MediaTek, continue to encounter tight capacity at their foundry partners and have to decelerate the development of their new chip products...
Monday 25 January 2021
BT substrate shipments for 5G handset SoCs may slow down in 2Q21
Taiwan's IC substrate suppliers will continue to enjoy robust shipments of BT-based FCCSP substrates for handset SoCs throughout first-quarter 2021, but may see off-season impacts...
Monday 25 January 2021
Intel not yet a major customer of TSMC
Despite speculation circulating recently that Intel is looking to outsource more chip production to TSMC, the CPU vendor does not seem to be ready to play a meaningful role in the...
Monday 25 January 2021
MediaTek to roll out upgraded 5G chips in 1H21
Judging from MediaTek's product roadmap, the chipmaker is expected to unveil the upgraded versions of its Dimensity 800 and 700 5G SoC lineups in second-quarter 2021, according to...
Monday 25 January 2021
ODMs see notebook order visibility extending in 2H21
Thanks to the stay-at-home economy driven by the coronavirus pandemic, notebook shipments are expected to stay robust in 2021, with ODMs see stable orders for the first half of the...
Friday 22 January 2021
NXP to highlight 5G PA modules, Wi-Fi 6E SoCs in 2021
Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Friday 22 January 2021
Highlights of the day: Pegatron reportedly reducing production for iPhone 12 mini
Weaker-than-expected sales for the iPhone 12 mini in the US and Europe reportedly has prompted Apple to have its manufacturing partner, Pegatron,...
Friday 22 January 2021
Nvidia, Qualcomm reportedly seeking TSMC support for next-generation manufacturing processes
Nvidia and Qualcomm reportedly have already reached agreements with TSMC for capacity support from its next-generation manufacturing processes, and with orders from Intel, Apple and...
Friday 22 January 2021
Rohm ramping up SiC power device output
Rohm recently held an opening ceremony announcing the completion of a new building at its Apollo plant in Chikugo, Japan. The facility is to enhance the company's production capacity...
Friday 22 January 2021
Kinsus to expand ABF substrate capacity by 30% in 2021
Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
Friday 22 January 2021
Intel reports record revenues for 2020
Intel has reported record revenues for 2020 at US$77.9 billion, up 8% on year, with its board of directors approved a cash dividend increase of 5% to US$1.39 per share on an annual...
Friday 22 January 2021
China panel makers step up AMOLED capacity expansions
China-based panel makers including BOE Technology, China Star Optoelectronics Technology (CSOT), Tianma Microelectronics and Visionox are all moving to build additional production...