Taiwan-based IC design houses have seen their supply constrained by tight foundry capacity, as well as longer delivery times at backend houses, according to industry sources.

As demand for semiconductor products has continued picking up, their supply has also grown tighter. Foundries' supply...

Taiwan's major automotive PCB makers Ching-Poon Industrial, Tripod Technology and Dynamic Electronics are set to sustain high capacity utilization throughout first-half 2021, but...

Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand...

Industrial computing device makers, including Advantech, Aaeon Technology, Adlink Technology, Avalue Technology, DFI and Axiomtek, wary of components shortages, are stepping up negotiations...

PCB manufacturers have seen the visibility of orders for automotive electronics applications extended to at least 4-5 months, but labor shortages may dent their actual shipments,...

More automotive chipmakers have approached Taiwan-based foundry houses TSMC, UMC and Vanguard International Semiconductor (VIS) seeking capacity support to meet a ramp-up in automotive...

The semiconductor industry has seen some major players committing significant sums for R&D, such as TSMC announcing to inject a record-high capex of up to US$28 billion in 2021...

Backend house ASE Technology has reported net profit of NT$27.59 billion (US$985.37 million) on consolidated revenue of NT$476.98 billion for 2020, with both results hitting the highest...

The LCD industry getting so mature that existing players are keen to look for new opportunities and technologies. Innolux's executive VP Chin-Lung Ting has told Digitimes that the...

South Korean panel makers are withdrawing from the LCD market, while their Chinese competitors, after frenzy expansion propelled them to the top of the LCD sector, are not expected...

At CES 2021's online exhibition, many notebook brand vendors showcased gaming products featuring higher resolution panels, new type of Chromebooks and dual-screen models eyeing the...

Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...

Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...

Dell is optimistic about the development of quantum technologies, heterogeneous architecture of semiconductors, 5G and edge computing in 2021, according to company CTO John Roese.