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IN THE NEWS
Friday 13 December 2019
Hisilicon to sell IoT chip modules on open market, executive says
Hisilicon Technologies, a chip arm of Huawei, will be ready to sell its IoT chip modules on open market in early 2020 at the earliest, according to company technology vice president...
Friday 13 December 2019
Oppo developing its own mobile chips, says report
Chinese handset vendor Oppo is currently developing a mobile processor in house, and the chip, dubbed M1, is an auxiliary processor, according to a China-based tech.qq.com...
Friday 13 December 2019
Goodix to ramp up optical in-display fingerprint sensor shipments in 2020
Goodix Technology is set to ramp up shipments of its optical in-display fingerprint sensors in 2020, and has reportedly reserved sufficient 8-inch fab capacity from TSMC, according...
Friday 13 December 2019
Gaming monitor panel market likely to see oversupply in 2020
The supply of gaming monitor panels could exceed market demand in 2020 as a growing number of panel makers are realigning their production lines to focus more on IT panels instead...
Friday 13 December 2019
AMS puts increased focus on non-mass market applications
Austrian sensor chipmaker AMS will move to enhance its focus on non-mass market applications including automotive, industrial and healthcare, according to Daniel Lee, country manager...
Thursday 12 December 2019
Highlights of the day: UMC enters Sony CIS supply chain
UMC's acquisition of Mie Fujitsu Semiconductor apparently has fulfilled two of its major strategic purposes: to expand its presence in the Japanese maket and the niche market. Through...
Thursday 12 December 2019
Demand for 5G mmWave chips not picking up until 2H20
SoC solutions supporting 5G mmWave technology are unlikely to make a meaningful presence in the 5G chip market until the second half of 2020, according to industry sources.
Thursday 12 December 2019
Backend firms to gain from robust high-spec auto CIS demand
Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Thursday 12 December 2019
Tianma ramping up flexible AMOLED panel capacity
China-based flat panel maker Tianma Microelectronics plans to convert its rigid AMOLED panel product lines at its 6G line in Wuhan to the production of flexible applications, with...
Thursday 12 December 2019
LCD materials maker Daxin to build new plant
LCD chemical material supplier Daxin Materials has disclosed plans to build a new plant at a cost of NT$550 million (US$18.1 million), which will focus on production of new key upstream...
Thursday 12 December 2019
Foxconn subsidiaries push into 5G businesses
Now that Young Liu has taken the helm, the Foxconn Technology Group (Hon Hai Precision Industry) has begun a series of transformations targeting the business opportunity from 5G,...
Thursday 12 December 2019
Global Unichip uses Cadence digital implementation and signoff flow to deliver designs for AI, HPC applications
Cadence Design Systems has announced that Global Unichip Corporation (GUC) successfully deployed its digital implementation and signoff flow and delivered advanced-node (N16, N12...
Thursday 12 December 2019
ITRI establishes laser source industry alliance
Taiwan's Industrial Technology Research Institute (ITRI) has assembled local laser source suppliers to form an industry alliance, looking to help them explore laser product business...
Thursday 12 December 2019
Taiwan IC design houses see increases in orders for 5G phones
Taiwan-based IC design houses have seen significant increases in orders for related ICs for 5G phones recently, particularly from first-tier Chinese handset brands, with the ramp-ups...
Thursday 12 December 2019
PCB maker Tripod on track to end 2019 with record revenues
HDI PCB specialist Tripod Technology is on track to meet its revenue target of NT$54 billion (US$1.77 billion) for 2019, a new high compared to the previous record of NT$52.1 billion...