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IN THE NEWS
Tuesday 10 December 2019
Flexible PCB makers gearing up for 5G iPhone antenna orders
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
Tuesday 10 December 2019
TSMC obtains Sony orders for CIS, says report
TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...
Tuesday 10 December 2019
Nuvoton braces for impact from acquiring loss-making business from Panasonic
Acquiring Panasonic's loss-making semiconductor business will have a negative impact on Nuvoton Technology's profitability in the short term, and it may take time for the business...
Monday 9 December 2019
Highlights of the day: Memory maker slows fab construction
Although the memory market looks to be heading towards a recovery in 2020, suppliers are cautious about expanding supply. Winbond is building a new plant in Kaohsiung, southern Taiwan,...
Monday 9 December 2019
ASE reportedly grabs SiP orders for new Qualcomm PC processor
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
Friday 6 December 2019
Highlights of the day: TSMC on track to start 3nm production in 2022
TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a ...
Friday 6 December 2019
MediaTek, Realtek to ramp Wi-Fi 6 chip output in 2020
MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
Friday 6 December 2019
AUO loses Motorola foldable Razr OLED orders to Chinese peers
Motorola has switched orders for flexible AMOLED panels for its new foldable smartphones to Chinese suppliers BOE Technology and China Star Optoelectronics Technology (CSOT) from...
Friday 6 December 2019
Qualcomm Snapdragon 865 flagship fabricated on TSMC 7nm without EUV
TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being...
Friday 6 December 2019
Semiconductor market suffers another plunge in 3Q19, says IHS
With revenues plunging by 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline despite some signs of growth in the critical...
Friday 6 December 2019
Taiwan IC design houses see orders slow down from China
Taiwan-based IC design houses have seen their China-based customers start slowing down their pace of orders due to year-end inventory checks at the clients, which may drag down revenues...
Thursday 5 December 2019
Lian Hong sees opportunity in notebook hinge business
Although the global notebook market's annual shipments have remained at around 160 million units for the past several years, Taiwan-based notebook hinge maker Lian Hong still sees...
Thursday 5 December 2019
Highlights of the day: 5G to see intense competition in midrange phone segment
Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models...
Thursday 5 December 2019
Taiwanese IC designers seeking closer partnerships with Chinese foundries
More Taiwan-based IC design houses are moving to strengthen partnerships with foundries in China so as to land more orders from Chinese brand vendors seeking to cut reliance on US...
Thursday 5 December 2019
Powerchip seeing strong demand for smartphone sensors
Powerchip Semiconductor Manufacturing (PSMC), a foundry subsidiary of Powerchip Technology, has enjoyed robust demand for smartphone-use sensors which is filling its 12-inch fab ca...