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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 30 October 2018
Intel to outsource entry-level processor, chipset production
As its processor supply continues to fall short of demand, Intel reportedly has begun planning to outsource production for its entry-level Atom processors and some of its chipsets...
Tuesday 30 October 2018
Flexium posts EPS of NT$3.22 in 3Q18
Flexible PCB (FPCB) specialist Flexium Interconnect has reported earnings per share of NT$3.22 (US$0.11) for the third quarter of 2018, when net profits hiked over 500% sequentially...
Tuesday 30 October 2018
Global large-size LCD panel capacity to rise over 9% annually through 2020, says Digitimes Research
Worldwide production capacity for large-size (9-inch and above) TFT LCD panels is projected to rise over 9% annually through 2020 resulting from continued capacity expansions by China-based...
Tuesday 30 October 2018
Cypress enters into JV with SK Hynix foundry unit
Cypress Semiconductor announced recently the company has entered into a joint venture with SK hynix system ic, a foundry spin-off of SK Hynix.
Tuesday 30 October 2018
Innovations count most for AI startups: Q&A with Xilinx president Victor Peng
While Intel and Nvidia have developed leading presence in the CPU and GPU fields, respectively, Xilinx has demonstrated solid innovation prowess in the FPGA space, constantly expanding...
Monday 29 October 2018
Micron opens DRAM backend fab in Taiwan
Micron Technology has announced the opening of a new plant in Taichung, central Taiwan that will be dedicated to providing backend services for the manufacture of DRAM memory.
Monday 29 October 2018
Cloud services to disrupt IC design process: Q&A with Microsoft Taiwan GM Ken Sun
At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual Design Environment...
Monday 29 October 2018
Himax, Kneron team up for AI-enabled security solution
Himax Technologies and Kneron, an artificial intelligence (AI) startup company, have jointly announced a collaboration to accelerate the development and commercialization of a high...
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Friday 26 October 2018
Globalfoundries, Chengdu government realign JV strategy
Globalfoundries and the Chengdu municipality have signed an amendment to their investment and cooperation agreement. Based on market condition changes, Globalfoundries' renewed focus...
Thursday 25 October 2018
IPC makers suffering from processor supply shortfall
IPC makers are reportedly joining PC and notebook suppliers to feel the pinch of supply shortfalls of processors from Intel, especially those with super-low voltage and low power...
Thursday 25 October 2018
North America semi equipment industry billings continue to decline
The three-month average of worldwide billings of North America equipment manufacturers registered a sequential decrease for the fourth consecutive month in September 2018, reaching...
Wednesday 24 October 2018
MediaTek unveils Helio P70 bringing AI to mid-range devices
MediaTek has announced the launch of the Helio P70 system-on-chip (SoC), with an enhanced AI engine combined with CPU and GPU upgrades. The Helio P70 also comes with upgraded imaging...
Wednesday 24 October 2018
TV panel prices to drop faster in November
The current downward adjustments of TV panel prices which began in October are likely to accelerate in November amid rising supply.
Wednesday 24 October 2018
Chip shipments for all-screen smartphones start ramping up
Shipments of chip solutions for all-screen smartphones, such as TDDI solutions, optical fingerprint identification chips and touch controller chips, have started growing fast as chipmakers...