As leading brand vendors are set to roll out 5G-based smartphone models in the first half of 2019, chipmakers such as Qualcomm and MediaTek have advanced the launch schedules for...

Qualcomm Technologies has announced what it calls the smallest additions to its QTM052 mmWave antenna module family of fully-integrated 5G NR millimeter wave (mmWave) modules for...

As 5G commercialization is set to kick off in 2019, global chipmakers including Qualcomm, Intel, MediaTek and UNISOC (Spreadtrum & RDA) are looking to expand their 5G solutions...

Arm has expanded its DesignStart program to include the Cortex-A5 CPU, Arm's low-power and Linux-capable application processor, according to the processor IP vendor. Developers can...

Flat panel makers are expected to see their operating results vary widely in 2019 as they adopt different approaches in strategy, market and product development to address the challenge...

Despite China's semiconductor industry aggressively carrying out diverse development projects, increasingly serious talent shortage is casting clouds over the development, making...

More than 50 IC designers, academic units and research bodies in China have recently established the China RISC-V Industry Consortium, seeking to develop the country's independent...

Fitipower Integrated Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in LCD driver ICs, started trading on the mainboard of the Taiwan Stock...

China-based flat panel makers Chongqing HKC Optoelectronics Technology (HKC) and China Electronics Corporation (CEC) both reportedly have held off on their original plans to build...

Taiwan Semiconductor Manufacturing Company (TSMC) is set to tape out more than 50 chip designs with its 7nm process technology by the end of 2018, and over 100 chip designs with both...

Taiwan-based IC design houses are expected to post over 10% sequential decreases in October revenues, as shipments during the first week of the month were affected by China's National...

CMOS image sensor demand (CIS) is set to boom for application to triple-lens camera phones and automotive electronics in 2019, prompting leading CIS maker Sony to expand capacity...

With tremendous growth of smartphones over the past decade, foundry sales to the communications market have soared and are now forecast to account for about 3x more than IC foundry...

Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.

At its recent forum in Beijing, Xilinx introduced its FPGA-based acceleration solutions designed for artificial intelligence (AI) and data center applications. Dubbed Alveo, the acceleration...