With demand for notebooks stronger than expected and notebook component suppliers conservative about their shipments, several components including panel, battery and solid state drive...

Shanghai Huali Microelectronics (HLMC) is expected to announce by the end of 2016 the construction of its second 12-inch plant, which will directly enter 28nm production, according...

France-based SES-imagotag and Taiwan-based Pervasive Displays (PDi) have signed a deal under which SES-imagotag will acquire 100% of PDi, according to the companies.

Cadence Design Systems has announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platf...

After an historic surge in semiconductor merger and acquisition agreements in 2015, the torrid pace of transactions has eased (until recently), but 2016 is already the second-largest...

Chip orders placed for the iPhone 7/7 Plus will likely fall about 20% sequentially in the first quarter of 2017, according to an estimate made by analog chip suppliers.

China-based Beijing Shanhai Capital Management announced that it has entered into a merger agreement with Analogix Semiconductor under which a consortium led by Shanhai Capital will...

Taiwan-based Phison Electronics' board of directors has approved plans to obtain 100% of its offshore business Everspeed and all the units under Everspeed including Memoryexchange...

MediaTek is considering rolling out two versions of its 10nm chips, the Helio X30 for high-end smartphones and the X35 for the lower-end segment, according to a Chinese-language Economic...

Silicon IP provider M31 has announced the development of its new MIPI M-PHY Gear3 IP on TSMC's 40LP and 28nm HPC+ process nodes. The 40LP M-PHY has been widely adopted by customers...

IC backend houses have recently seen their supply fall short of demand as their delivery times have extended to more than two weeks, up from 4-7 days, according to industry sources...

The government-sponsored Shanghai Industrial Technology Research Institute (SITRI) has its 8-inch wafer fab targeted specifically at the manufacture of MEMS parts with volume production...

The bill of materials (BOM) for an iPhone 7 equipped with 32GB of NAND flash memory carries US$219.80 in bill of materials costs, according to a preliminary estimate from IHS Marki...

Cadence Design Systems has announced the availability of a Cadence Rapid Adoption Kit (RAK) for the new ARM Cortex-R52 CPU, which targets complex embedded designs for safety applications...

Beijing-based GigaDevice Semiconductor has reportedly taken over a Memoright plant located in Wuhan, which could pave the way for the China-based NOR flash vendor to step into the...