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IN THE NEWS
Tuesday 20 September 2016
Asia-Pacific to top 2016 regional IC sales in major system categories, says IC Insights
Asia-Pacific's grip as the dominant market for IC sales is forecast to strengthen in 2016 with the region expected to account for 61% of the US$282.0 billion IC market, according...
Tuesday 20 September 2016
BOE reportedly sets up new R&D team for bio-sensors
China-based BOE has teamed up at least 100 engineers engaged in R&D for bio-sensors, according to industry sources. A business unit has also been set up under BOE to focus on...
Tuesday 20 September 2016
ASE a major SiP backend provider for Apple, say sources
Advanced Semiconductor Engineering (ASE), through its Shanghai-based subsidiary Universal Scientific Industrial (USI), has obtained SiP (system-in-package) backend orders for Wi-Fi,...
Tuesday 20 September 2016
WPG 3Q16 revenues to rise up to 10%, says report
IC distributor WPG is expected to post revenue growth of up to 10% sequentially in the third quarter of 2016, a recent Chinese-language Economic Daily News (EDN) report quoted...
Monday 19 September 2016
US fab-tool book-to-bill ratio stays above parity, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.03 in August 2016, having been above parity for nine months in a row, according to the...
Monday 19 September 2016
Sprint intros MediaTek-powered smartphone
Sprint has introduced the LG X Power, which features the MediaTek Helio P10-series chipset. The device is the first MediaTek-powered smartphone available from Sprint breaking new...
Monday 19 September 2016
China market: Oppo still ramping up component, panel orders, say sources
China-based smartphone vendor Oppo, which had its shipments impeded partially by tight supply of flat panels recently, has continued to ramp up its orders for parts and components,...
Wednesday 14 September 2016
Global 2Q16 semiconductor equipment billings increase 26%, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$10.5 billion in the second quarter of 2016, according to SEMI. The billings figure was 26% higher than the prior...
Wednesday 14 September 2016
Socionext introduces high image quality, H.264 full-HD multi-channel Codec
Socionext Inc., an emerging leader in advanced SoC technology for video and imaging systems, today announced the release of SC2M15, a new codec IC designed for video transmission...
Wednesday 14 September 2016
Chip orders for iPhone 7 higher-than-expected
Chip orders for the iPhone 7 placed thus far for 2016 are higher than previously estimated, according to industry sources.
Tuesday 13 September 2016
ASMedia sees revenues hit record high in August
USB 3.0 chip controller design-house ASMedia Technology saw its consolidated revenues expand 47.8% on month and 40.8% on year to a record high of NT$208 million (US$6.566 million)...
Tuesday 13 September 2016
Introducing the world's smallest LoRa+MCU solution with the utilization of SiP process
The world's first SiP (System in Package) processed LoRa+MCU solution is presented today through the extraordinary collaboration between the world-leading Internet of Things solution...
Tuesday 13 September 2016
Taiwan fingerprint sensor suppliers set to post strong 3Q16
Taiwan-based fingerprint sensor suppliers including Egis Technology (Egistec), Elan Microelectronics and FocalTech Systems are set to post brisk sales for the third quarter of 2016...
Tuesday 13 September 2016
ALi completes share repurchase
Set-top box (STB) solution provider ALi has repurchased about NT$53.28 million (US$1.68 million) worth, or 3.1 million units, of its common shares from the open market, according...
Tuesday 13 September 2016
Himax, Nuviz team up for HUD products
Taiwan-based fabless IC firm Himax Technologies has announced it is partnering with Nuviz to develop head-up display (HUD) products.