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Chipbond raises capex

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 2 September 2009 0

Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional capex will be mainly utilized for purchasing used testing equipment.

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