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Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 2 December 2009 0

Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of transferring part of MCS' production for driver IC-use chip on film (COF)...

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