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Scientech deepens development of 3D IC, wafer-level packaging equipment

Patty Wang, Taipei; Steve Shen, DIGITIMES Asia Thursday 31 January 2013 0

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to be verified by clients in the second half of 2013, according to industry...

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