NAND flash vendors gearing up for 3D chips
Josephine Lien, Taipei; Jessie Shen, DIGITIMES
Samsung Electronics, Toshiba and Micron Technology have recently disclosed their 3D NAND flash memory developments. The vendors' 3D NAND chips are expected to be in early-stage production during 2014-2015, followed by the commercial production stage...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.