Micron Technology has unveiled a new NAND flash fab in Singapore with commerical run to start later this year focusing on 96-layer and beyond 3D processes, as it seeks to rely on technology advancements to increase bit-output. The company has also noted that the memory market will be relatively normal in the second-half 2019 after seeing weakened demand in the first half. In China, foundry house SMIC is also making tech advancements, ready to move its 14nm FinFET process to volume production by the end of 2019.
Micron opens new NAND flash fab in Singapore: Micron Technology has unveiled a new 12-inch fab at its manufacturing site for NAND flash memory in Singapore, and expects the facility to ramp up production in the second half of 2019 focusing on 96-layer and higher 3D processes.
SMIC to move FinFET process to volume production by year-end 2019: China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.
