Memory vendors may have seen robust demand from the server sector, but shipments to consumer electronics have slumped. Now memory spot market prices are under downward pressure, as transactions remain slow amid buyers' wait-and-see attitude towards the developments of the coronavirus pandemic. While memory buyers are cautious, chip vendors at the top of the semiconductor sector are still keen on R&D for their advanced offerings and on securing the most advanced manufacturing capacity support from TSMC, keeping the world's top foundry house in good health. In the smartphone space, Samsung remains a trendsetter. It is reportedly developing its next-generation foldable Galaxy Fold with ultrathin cover glass, instead of polyimide.
Memory prices come under downward pressure: DRAM and NAND flash prices are facing increasing downward pressure, due to a slump in demand for consumer electronics devices, according to industry sources.
TSMC enjoys ramp-up in orders from AMD, Nvidia: A ramp-up in short lead-time orders placed by AMD and Nvidia will allow TSMC to post relatively strong results compared to other foundries in the first half of 2020, according to industry sources.
Samsung likely to use UTG as cover glass for next-gen Galaxy Fold: Samsung Electronics is expected to give the priority to the use of ultrathin glass (UTG) over polyimide (PI) films as cover glass solutions for its upcoming second-generation Galaxy Fold, according to industry sources.
