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First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble

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Samsung jumps into AI, set to unveil cutting-edge 3D packaging tech in 2024

Amy Fan; Willis Ke, DIGITIMES Asia Monday 20 November 2023 0

Credit: DIGITIMES

With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024, entering the competitive realm of advanced packaging. All eyes in...

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SK Hynix starts mass production of world's first 321-high NAND

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