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FOPLP gains momentum in advanced packaging as AI demand surges

Janet Kang, Taipei; Jerry Chen, DIGITIMES Asia Wednesday 4 September 2024 0

Credit: DIGITIMES

As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique, is also gaining traction due to its high utilization rate.

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