CONNECT WITH US

Winbond to allocate more capacity for specialty DRAM

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia 0

Winbond president Pei-Ming Chen. Credit: DIGITIMES

Winbond Electronics will be ramping up its 25nm process manufacturing output for specialty DRAM products starting the first quarter of 2022, according to company president Pei-Ming Chen.

The article requires paid subscription. Subscribe Now