Technological breakthroughs in diamond semiconductors, known for their superior performance despite technical challenges, could lead to practical applications as early as 2025 to 2030. Several Japanese research teams continue to make significant strides in this field.
According to Nikkei, Saga University successfully developed the world's first power device made from diamond semiconductors in 2023. The same year, the university collaborated with the Japan Aerospace Exploration Agency (JAXA) to develop high-frequency diamond semiconductor components for space communication.
Tokyo-based precision parts manufacturer Orbray has successfully developed mass-production technology for 2-inch diamond wafers, pushing the limits of size manufacturing. The company is expected to soon complete research and development for 4-inch substrates. Additionally, Mirai Technologies, jointly funded by Toyota and Denso, is collaborating with Orbray to develop onboard diamond power devices, aiming for commercialization in the 2030s.
Orbray is also working with Anglo American plc to advance its artificial diamond substrate business, focusing on developing large-diameter diamond substrates for use in power semiconductors and communications. The company plans to expand its production facilities in Akita Prefecture, Japan, with an initial public offering expected in 2029.
Power Diamond Systems, a Japanese startup spun off from Waseda University, successfully developed a technology in 2023 to enhance the current-carrying capacity of diamond power devices. The company plans to launch samples in the coming years and has established a partnership with Kyushu Institute of Technology.
Meanwhile, Ookuma Diamond Device, a startup derived from Hokkaido University and the National Institute of Advanced Industrial Science and Technology (AIST), is constructing a large mass production factory in Okuma, Fukushima Prefecture. The facility is expected to start operations in the 2026 fiscal year (April 2026 to March 2027), aiming to use its products in nuclear waste removal equipment for the Fukushima Daiichi Nuclear Power Plant.
These nuclear waste materials are high-radioactivity remnants generated from the reactor structure and the melting of nuclear fuel during the 2011 Fukushima disaster. They can only be processed by devices like diamond semiconductors that can withstand high radiation.
The potential for diamond semiconductors to accelerate commercialization is drawing increased attention to related businesses. For instance, JTEC Corporation specializes in producing precision equipment for research facilities and has developed a plasma technology for polishing the surfaces of high-hardness materials.
EDP is Japan's only company engaged in the manufacture and sale of synthetic diamond seeds for gemstones, boasting the world's largest single-crystal production mechanism. The company is also involved in the production of diamond semiconductor substrates and tool materials.
As diamond semiconductor technology advances, the quality and stable supply of synthetic diamonds are gaining importance. Sumitomo Electric produced the world's largest synthetic diamond single crystal in the 1980s, named SumiCrystal, using high-quality materials for industrial applications.
Currently, most synthetic diamond production is concentrated in India and China. South Korea is set to develop a technology in 2024 that shortens the time required to produce synthetic diamonds. A study published in Nature by the Korean Institute for Basic Science (IBS) introduces a new technique that uses a liquid metal alloy composed of gallium, nickel, and other materials to create artificial diamonds in 150 minutes.
