Apple's mixed reality (MR) headset, the Vision Pro, is known to feature two key chips—the M2 for handling most computations and the R1 for reducing latency and processing sensor data. The memory integrated with the R1 chip plays a crucial role in enhancing processing speed.
SK Hynix leads the pack
Reports had previously suggested that SK Hynix supplied the memory for the R1 chip, and a recent teardown report by TechInsights confirms that the core component is the South Korean giant's H5EA1A56MWA 1GB LLW DRAM. This memory offers high density and performance, supporting the real-time computational needs of the device.
According to a report by Patently Apple, the H5EA1A56MWA chip uses a 1Ynm CMOS process with six metal interconnect layers, including tungsten, copper, and aluminum. Capacitors are placed between the metal layers and supported by silicon nitride (SiN) storage nodes. The chip features four identical memory circuit areas, each containing 16 memory arrays. This intricate design maximizes DRAM area efficiency, achieving high density and performance.
The R1 APL1W08 chip, manufactured using TSMC's InFO-M technology, is packaged with 1,961 solder bumps and is highly compatible with SK Hynix's DRAM chip, balancing performance and space optimization.
In addition to the R1 and M2 chips, the Vision Pro's motherboard also houses a TMNB26 processor chip and another SK Hynix DRAM chip.
The teardown report highlights key components of the motherboard, including the R1 chip, a 64-bit 8-core M2 processor, and 8GB LPDDR5 SDRAM from SK Hynix.
Other components include: Apple's power management IC, Kioxia's 256GB 3D TLC NAND flash memory, NXP's NFC and security chip, STMicroelectronics' power management IC, Renesas Electronics' load switch, Nexperia's 4-bit dual power buffer, SiTime's MEMS oscillator, Texas Instruments' single-bus transceiver, Onsemi's LDO regulator, Murata's SAW filter and 2.4GHz Wi-Fi front-end module, Skyworks' 5GHz front-end module and Qorvo's SPDT RF switch.
The Vision Pro also includes two 100Hz micro OLED displays, with the following primary electronic components: Apple's micro OLED display driver, Texas Instruments' current/power monitor, Dialog Semiconductor's programmable mixed-signal array, Winbond serial flash memory (16MB), and Analog Devices' LDO regulator.
For the battery subsystem, key components include:
Bosch Sensortec three-axis MEMS accelerometer, Texas Instruments' adjustable buck converter, Nexperia's single-bus and tri-state buffer, GigaDevice serial flash memory, Onsemi's 28V/5A current-limiting switch, Renesas Electronics' battery charger and buck-boost regulator.
Pricy components
TechInsights also identified the highest-cost components in the Vision Pro:
-US$432.20 - 100Hz micro OLED display subsystem (Sony), two units (one for each side)
-US$111.69 - 64-bit 8-core M2 processor (Apple)
-US$98.12 - Sensor processor R1 chip (Apple)
-US$86.35 - Battery subsystem (Apple)
-US$44.59 - Left-side audio band subsystem
-US$39.53 - Right-side audio band subsystem
-US$39.45 - 8GB mobile LPDDR5 SDRAM (SK Hynix)
-US$16.79 - 256GB 3D TLC NAND flash memory (Kioxia)
