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Innolux targets panel packaging mass production among delays

Rebecca Kuo, DIGITIMES, Taipei 0

Innolux GM James Yang (L) and Chairman Jim Hung (R). Credit: DIGITIMES

Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter ends, Chairman Jim Hung offered limited reassurance, stating only...

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